Chip Attach Module Engineer - (603124)
In this position, you will be responsible for developing new or modifying process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication and evaluation of semiconductors. Your responsibilities will include but not be limited to:
- Reviewing product requirements with design staff to ensure compatibility of processing methods.
- Compiling and evaluating test data to determine appropriate limits and variables for process or material specifications.
- Conceiving and planning projects involving definition and selection of new concepts and approaches in the processing or development of new or improved processes in photomasking, diffusion, deposition, wafer fabrication and device physics.
- Working on complex issues where analysis of situations or data requires an in-depth evaluation of variable factors.
- Exercising judgment in selecting methods, techniques and evaluation criteria for obtaining results.
Requirements:
Additional qualifications include: You must possess a Bachelor of Engineering degree in Mechanical, Chemical, Electrical, Electronics Engineering or equivalent.
Ability to work well in a diverse team environment.
Excellent verbal and written communication skills
The following qualifications would be added advantages:
Problem solving
Statistical knowledge
Programming knowledge
